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Shenzhen KHJ Technology Co., Ltd
Manufacturer of semiconductor adhesive film solutions
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TS630 Thermal Release Tape: High Initial Adhesion, RoHS Compliant, For E-Comp, Glasses, Wafer, Ceramics

Shenzhen KHJ Technology Co., Ltd
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TS630 Thermal Release Tape: High Initial Adhesion, RoHS Compliant, For E-Comp, Glasses, Wafer, Ceramics

Brand Name : khj

Model Number : TS630

Certification : SGS

Place of Origin : China

MOQ : 10

Price : 18.88

Delivery Time : 7 day

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Description

TS630 is a green polyester film backed pressure-sensitive adhesive single- sided coated thermal release tape. It has a high initial adhesion and easily is peeled off by heating under a certain high temperature.

Construction

TS630 Thermal Release Tape: High Initial Adhesion, RoHS Compliant, For E-Comp, Glasses, Wafer, Ceramics

Features

Easily peeled off by heat treatment at any time

Excellent tensile strength & Elongation

RoHS Compliant

Application

For electronic component ,glasses ,wafer ,ceramics manufacturing

processes.

For various temporary fixing.

Properties

Item Typical Value Test Method
Imperial Metric
Backing 3.0mil 0.075mm /
Total Thickness 5.4mil 0.135±0.005mm /
Tack / ≥ 12(J.DOW/#) /
Adhesion Before heating 0.11lbs/in 0.5N/25mm GBT 2792-2014
After heating 0 0
Tensile Strength ≥20lbs/in ≥3.5 (KN/M) GBT 30776-2014
Elongation ≥45% ≥45% GBT 30776-2014

Storage

Store under normal conditions of 10-30℃ and 40-70% R.H, out of direct

sunlight.

Shelf life: 12 months from the date of manufacture when stored in initial

packing.

Precaution Reminder

Surface should be clean, dry, free of dust, oil or other contaminants.

Proper pressure required by roller, hand or press when applying.

Avoid repeat sticking to prevent adhesion decrease.

Notes

Please be advised that this technical data sheet is written based on our lab tests and experience only.

Customer is responsible to determine the suitability of the product meets intended application requirements before approved for use.


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